Double-sided polishing is used to improve both surfaces of precision glass, quartz, fused silica, sapphire, silicon, glass-ceramic and optical substrates that require strict surface quality, flatness, parallelism and thickness control. With achievable surface roughness below 0.5 nm Ra, TTV below 2 μm and flatness up to λ/4 or better depending on the requirement, this process is suitable for high-precision optical, semiconductor, laser, metrology and aerospace applications.
We provide custom double-sided polishing services for prototypes and batch production, supporting substrate sizes from 10–300 mm and thicknesses from 0.3–50 mm. Finished parts can be supplied according to drawing requirements, with optional AR, HR, ITO or metal coating, and inspection documentation such as measurement reports and CoC when required.
