1. Basic Information
| Item | Specification |
|---|---|
| Material Type | Borosilicate Float Glass |
| Brand | SCHOTT® |
| Grade | BOROFLOAT® 33 |
| B₂O₃ Content | ≈ 13 wt% |
| Density | 2.20 g/cm³ |
2. Thermal Properties
| Item | Specification |
|---|---|
| CTE (0–300°C) | 3.25 × 10⁻⁶ /°C |
| Softening Point | ≈ 820°C |
| Annealing Point | ≈ 560°C |
| Strain Point | ≈ 510°C |
| Thermal Conductivity | 1.20 W/(m·K) |
3. Mechanical Properties
| Item | Specification |
|---|---|
| Young’s Modulus | 64 GPa |
| Shear Modulus | 26.6 GPa |
| Poisson’s Ratio | 0.20 |
| Knoop Hardness | ≈ 480 kg/mm² |
| Flexural Strength | ≈ 25 MPa (as-cut) |
4. Optical Properties
| Item | Specification |
|---|---|
| Refractive Index @ 587.6 nm | 1.471 |
| Abbe Number | 65.8 |
| Transmission Range | 300–2500 nm (typical) |
| Appearance | Transparent, Colorless |
| Surface Quality | Fire-Polished Float Surface |
5. Chemical Properties
| Item | Specification |
|---|---|
| Water Resistance (DIN ISO 719) | Class HGB 1 |
| Acid Resistance (DIN 12116) | Class S 1 |
| Alkali Resistance (DIN ISO 695) | Class A 2 |
| HF Resistance | Poor (attacked by HF) |
| Overall Chemical Durability | Excellent |
6. Typical Applications
| Field | Application |
|---|---|
| Semiconductor | Wafer Bonding Substrates & Process Windows |
| MEMS | Anodic Bonding with Silicon Wafers |
| Microfluidics | Lab-on-Chip & Microfluidic Devices |
| Optics | Precision Optical Windows & Filter Substrates |
| Display | Flat Panel Display Substrates |
