Glass Materials
Glass-Ceramic
Quartz Glass / Fused Silica
Borosilicate Glass
Heat-Resistant Glass / High-Temperature Glass
Low Expansion Glass / Low-CTE Glass
Ultra-Thin Glass
Semiconductor Glass
Optical Glass
Glass Processing
Precision Etching / Chemical Etching
Glass CNC Machining
Glass Bonding
Double-Sided Processing (Grinding & Polishing)
Laser Processing / Laser Micromachining
Glass Cutting
Optical Coatings
Anti-Reflection (AR) Coating
Infrared (IR) Anti-Reflection Coating
Hydrophobic Coating & Indium Tin Oxide (ITO)
Metallized Coating / Metal Coating
Anti-Fingerprint (AF) Coating
CNC milled microfluidic glass chip with precision channels and drilled holes
CNC milling of a transparent glass part with coolant and diamond tooling
Custom CNC milled glass components with pockets, grooves, holes and polished edges
Precision CNC milling of a glass-ceramic component for optical and industrial applications
CNC milled microfluidic glass chip with precision channels and drilled holes
CNC milling of a transparent glass part with coolant and diamond tooling
Custom CNC milled glass components with pockets, grooves, holes and polished edges
Precision CNC milling of a glass-ceramic component for optical and industrial applications

CNC Milling for Precision Glass and Brittle Materials

CNC milling is suitable for glass and brittle-material parts that need more than simple cutting or drilling. It is used to create pockets, channels, stepped structures, chamfers, undercuts, external contours and 3D features in materials such as fused silica, quartz glass, borosilicate glass, glass-ceramic, sapphire, silicon and technical ceramics.

For CNC-milled glass parts, the key details are not only the outer size, but also the feature width, channel depth, wall thickness, corner radius, tolerance, surface roughness and whether post-polishing is required.

This process is commonly used for:

Microfluidic components — serpentine channels, reagent wells, mixing chambers and custom flow paths.
Optical and laser parts — lens mount bodies, mirror substrates, coolant channels and precision support structures.
Semiconductor fixtures — wafer-handling jigs, vacuum channels, alignment pockets and carrier components.
Scientific instrument parts — custom chambers, flow cells, feedthrough housings and machined glass structures.

We can process CNC-milled glass parts according to CAD drawings, STEP files, material specifications and application requirements. For complex parts, milling can also be combined with drilling, contouring, slotting, polishing, chemical etching, coating and inspection.

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Details Introduction

What Is CNC Milling?

CNC milling for glass and brittle materials is a subtractive machining process that uses rotating diamond-coated or diamond-sintered cutting tools to remove material and create complex 3D geometries — including pockets, channels, steps, chamfers, and freeform surfaces. Unlike conventional metal milling where tools shear material, brittle-material milling relies on controlled micro-fracture and abrasive grinding at the tool-workpiece interface, with continuous coolant flow to flush debris and prevent thermal stress. Modern 5-axis CNC platforms enable simultaneous multi-axis tool positioning, allowing undercuts, angled features, and freeform contours to be produced in a single setup. CNC milling is essential for microfluidic device fabrication, optical mount bodies, semiconductor process components, and any application requiring complex 3D features in hard, brittle substrates.

Process Capabilities

  • Feature Tolerance: ±5 µm (precision); ±20 µm (standard)
  • Minimum Feature Size: 0.2 mm wall thickness / 0.3 mm channel width
  • Maximum Part Size: 500 × 500 × 200 mm (XYZ envelope)
  • Position Accuracy: ±3 µm across full workpiece
  • Axis Configuration: 3-axis, 4-axis, and full 5-axis simultaneous machining
  • Surface Roughness (Ra): 0.4 – 0.8 µm (as-milled); 0.05 µm (post-polished)
  • Repeatability: ±2 µm batch-to-batch

Compatible Materials

1Fused SilicaCorning 7980 / Tosoh ES-2000
2Quartz GlassSCHOTT Lithosil Q / Heraeus Suprasil 1
3Borosilicate GlassPYREX 7740 / BOROFLOAT 33
4Soda-Lime GlassFloat / Tempered
5SapphireC-plane / A-plane
6Glass-CeramicZERODUR / PYROCERAM 9606 / MACOR
7Optical GlassBK7 / N-BK7
8Technical CeramicsAl₂O₃ / AlN / Si₃N₄ / ZrO₂
9SiliconFloat Zone / Czochralski
10CaF₂UV-grade / IR-grade
11GermaniumSingle crystal / Polycrystalline

Feature Types & Geometry

  • Pockets & Cavities: Flat-bottom, stepped, and freeform recesses down to 0.3 mm wide
  • Channels & Grooves: Straight, curved, and serpentine channels for microfluidics
  • Steps & Shoulders: Multi-level features with sharp or radiused transitions
  • Chamfers & Fillets: Edge conditioning from C0.1 to C5.0
  • Freeform Surfaces: 3D contoured surfaces for lens mounts and optical housings
  • Undercuts: Full 5-axis undercut machining with side-mounted tooling
  • External Contours: Complex perimeter profiling and non-rectangular outlines

Typical Applications

  • Microfluidic Chips: Serpentine channels, mixing chambers, and reagent wells
  • Optical Mount Bodies: Precision lens barrels and mirror mounting substrates
  • Semiconductor Carriers: Wafer-handling jigs with vacuum channels and alignment pockets
  • Laser Cavity Components: Coolant channels and mounting features in fused silica
  • Aerospace Optics: Lightweighted mirror substrates with pocket-milled back structures
  • Scientific Instruments: Custom chambers, flow cells, and feedthrough housings

Custom Specifications

We accept custom CNC milling orders from single prototypes to production batches, with full support for CAD-driven manufacturing based on STEP, IGES, or native CAD files. Custom workflows include integrated operations combining milling with drilling, contouring, and slotting in a single setup, as well as post-machining services such as edge polishing, chemical etching, AR coating, and full CMM inspection. All milled parts are delivered with dimensional reports, surface roughness measurements, and material traceability documentation. For high-precision optical components, we also offer post-milling lapping and polishing to meet λ/10 surface figure requirements.

Milling Capability Map: Feature Size vs Depth

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