1. Basic Information
| Item | Specification |
|---|---|
| Material Type | Synthetic Fused Silica |
| Brand | Tosoh® |
| Grade | ES-2000 |
| Typical OH Content | ≈ 600–1000 ppm (High OH) |
| Density | 2.20 g/cm³ |
2. Thermal Properties
| Item | Specification |
|---|---|
| CTE (0–300°C) | 0.51 × 10⁻⁶ /°C |
| Softening Point | ≈ 1585°C |
| Annealing Point | ≈ 1042°C |
| Strain Point | ≈ 890°C |
| Thermal Conductivity | 1.38 W/(m·K) |
3. Mechanical Properties
| Item | Specification |
|---|---|
| Young’s Modulus | 72.5 GPa |
| Shear Modulus | 31.2 GPa |
| Poisson’s Ratio | 0.17 |
| Knoop Hardness | ≈ 520 kg/mm² |
| Flexural Strength | ≈ 65 MPa |
4. Optical Properties
| Item | Specification |
|---|---|
| Refractive Index @ 587.6 nm | 1.4584 |
| Abbe Number | 67.7 |
| Transmission Range | 170–2500 nm |
| UV Transmission | Excellent (Deep UV) |
| Homogeneity | Δn ≤ 2 × 10⁻⁶ |
5. Electrical Properties
| Item | Specification |
|---|---|
| Dielectric Constant (20°C, 1 MHz) | 3.75 |
| Loss Tangent | ≈ 0.0001 |
| Volume Resistivity | > 10¹⁸ Ω·cm |
| Dielectric Strength | ≈ 250–400 kV/cm |
6. Chemical Purity
| Item | Specification |
|---|---|
| SiO₂ Content | > 99.99% |
| Metal Impurities | < 1 ppm (total) |
| Bubbles & Inclusions | Extremely Low |
| Chemical Resistance | Excellent (except HF) |
7. Typical Applications
| Field | Application |
|---|---|
| Semiconductor | Photolithography Windows, Diffusion Tubes, Wafer Carriers |
| Optics | UV Optical Elements, Precision Lenses |
| Laser | Excimer Laser Optics, UV Laser Windows |
| Metrology | Reference Flats, Optical Standards |


